Product application object：Semiconductor, SMT, DIP, electronic components detection
Inspection content: bubble area, false solder, leakage of solder, foreign matter, more tin less tin and other defects
Product parameters:
IM center：
No.301 Yinxiu Road, Binhu District, Wuxi
AI Lab：
19F, Block A, Sanfeng Building, No.38 Torch Road, Hi-Tech Park, Dalian
Enterprise Email：
Klaus@3000gy.com
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