Electronics Manufacturing

◈  For Products

FPCA, PCBA, automotive electronic modules and power semiconductors, etc.



Power Semiconductor

◈  Main defect types

Cracks/foreign objects inside electronic components, PCB internal line displacement, poor alignment or bridging and disconnection, BGA empty solder, false solder, substandard solder climbing, incomplete solder balls in solder ball array packaging and chip packaging

◈  X-ray inspection chart

Missing solder