Electronic semiconductor x-ray online inspection equipment
Product application object：Semiconductor, SMT, DIP, electronic components detection
Inspection content: bubble area, false solder, leakage of solder, foreign matter, more tin less tin and other defects
Product parameters:
分享
| Equipment model | AXI-3100 |
| Number of radioactive sources | 1 |
| Detection efficiency | 0.5 -1.5s/ 点位 |
| Automatic detection index | |
| The following are the details of the expansion | |
| False detection rate | <=1% |
| Miss rate | 0% |
