Electronic semiconductor x-ray online inspection equipment

Product application object:Semiconductor, SMT, DIP, electronic components detection

Inspection content: bubble area, false solder, leakage of solder, foreign matter, more tin less tin and other defects

Product parameters:

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Equipment model AXI-3100
Number of radioactive sources 1
Detection efficiency 0.5 -1.5s/ 点位
Automatic detection index  
The following are the details of the expansion
False detection rate <=1%
Miss rate 0%